When this option is enabled, changes made will affect only the object being placed and subsequent objects placed during the same placement session. While attributes can be modified during placement ( Tab to access the Properties panel), keep in mind that these will become the default settings for further placement unless the Permanent option on the PCB Editor – Defaults page of the Preferences dialog is enabled. Continue placing further fills or right-click or press Esc to exit placement mode.Move the cursor to adjust the size of the fill then click or press Enter to anchor the diagonally-opposite corner and complete placement of the fill.Click or press Enter to anchor the first corner of the fill.Placement is made by performing the following sequence of actions: Click the button on the PCB Lib Placement toolbar.Īfter launching the command, the cursor will change to a cross-hair and you will enter fill placement mode.Right-click in the design space then select Place » Fill from the context menu.PCB Library Editor - the following methods of access are available:.Click the button on the Wiring toolbar.Right-click in the design space then click Place » Fill from the context menu.Once a command has been used, it will become the topmost item on that section of the Active Bar.) (Click and hold an Active Bar button to access other related commands. Click the Fill button ( ) in the drop-down on the Active Bar located at the top of the design space.Choose Place » Fill from the main menus.PCB Editor - the following methods of access are available:.Availabilityįills are available for placement in both the PCB and PCB Library editors in the following ways: In the PCB Library Editor, fills can be used to define component footprints. Place a Fill on a Power Plane, Solder Mask or Paste Mask layer to create a void on that layer. For example, place a Fill on the Keep-Out layer to designate a 'no-go' area for auto-routing. Fills of varying size can be combined to cover irregularly shaped areas and can also be combined with track or arc segments and be connected to a net.įills also can be placed on non-electrical layers. When placed on a signal layer, a fill becomes an area of solid copper that can be used to provide shielding or to carry large currents. If a Fill is placed on a signal layer, it can be connected to a Net.Ī fill is a rectangular object that can be placed on any layer. Fills are limited to a rectangular shape and will not avoid other objects, such as pads, vias, tracks, regions, other fills or text. Fills and Solid RegionsĪ fill ( Place » Fill) is a rectangular-shaped design object that can be placed on any layer, including copper (signal) layers. To learn more about power planes, see the Internal Power & Split Planes page. To provide an electrically-stable ground or power reference throughout the PCB, power planes are used. To learn more about Polygon Pours, see the Polygons on Signal Layers page. In more complex cases, Polygon Pours are used. The advantage of a Polygon Pour is that it automatically pours around copper objects that belong to another net in accordance with the applicable Electrical Clearance and Polygon Connect Style Design Rules. Fill and Solid Region objects are described below on this page. These are rectangular and polygon-type objects that will not pour around other objects such as pads, vias, tracks, or text. In simple cases, Fills and Solid Regions can be used. In Altium Designer, areas of copper can be defined using different design objects. It could be a hatched region of grounding copper on an analog design, a large, solid region of copper for carrying heavy power supply currents, or a solid ground area for EMC shielding. A common requirement on a printed circuit board is large areas of copper.
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